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US 9,808,875 B2Granted
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
AssigneeIntel Corporation
InventorsDeepak V. Kulkarni, Carl L. Deppisch, Leonel R. Arana, Gregory S. Constable, Sriram Srinivasan
Life of this patent
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Abstract
Methods and associated structures of forming a package structure including forming a low melting point solder material on a solder resist opening location of an IHS keep out zone, forming a sealant in a non SRO keep out zone region; attaching the IHS to the sealant, and curing the sealant, wherein a solder joint is formed between the IHS and the low melting point solder material.
Claims8
A method comprising:
- forming a low melting point solder material on a location of an integrated heat spreader (IHS);
- forming a sealant in a keep out zone (KOZ) region of a substrate, wherein the sealant is not formed in a solder resist open (SRO) region of the KOZ, wherein the SRO region is a plurality of openings formed into a top surface of the substrate;
- bringing the IHS into contact with the sealant, wherein the low melting point solder material is only located in the SRO region of the KOZ;
- and
- curing the sealant, wherein a solder joint formed from the low melting point solder material is formed between the IHS and the substrate during the curing of the sealant, and wherein the melting temperature of the low melting point solder material is less than or equal to a curing temperature of the sealant.
2 more elements
Dependencies are inferred from the claim text.