Substrate processing apparatus
AssigneeEbara Corporation
InventorsTetsuji Togawa, Kenya Ito, Yu Ishii, Keisuke Uchiyama
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Abstract
There is disclosed a substrate processing apparatus which is capable of detecting whether a substrate, such as a wafer, supported by a fluid is properly present in a predetermined processing position or not. The substrate processing apparatus includes at least one distance sensor configured to measure a distance between a scrubber and a hydrostatic support structure; and a processing controller configured to calculate a gap between the hydrostatic support structure and the surface of the substrate from a measured value of the distance and determine whether the gap falls within a predetermined range or not.
Claims8
A substrate processing apparatus for processing a substrate having a first surface and a second surface, the second surface being an opposite surface of the first surface, the substrate processing apparatus comprising:
- a scrubber configured to place at least one scrubbing member in sliding contact with the first surface of the substrate to process the first surface, the scrubber having a plurality of deformable elastic members supporting the at least one scrubbing member, the plurality of elastic members having top surfaces, respectively, which are spaced from each other;
- and
- a hydrostatic support structure configured to support the second surface of the substrate via fluid without contacting the substrate.
Dependencies are inferred from the claim text.