Methods and apparatus for applying adhesives in patterns to an advancing substrate

An apparatus for applying a fluid in a pattern to an advancing substrate, the substrate having an unconstrained caliper, Hs, and having a first surface disposed opposite of a second surface, the apparatus comprising:

• a slot die applicator including a slot opening, a first lip, and a second lip, the slot opening located between the first lip and the second lip;
• a substrate carrier adapted to advance the substrate past the slot die applicator, wherein when the first surface of the substrate is disposed on the substrate carrier, the substrate carrier is adapted to advance the second surface of the substrate past the slot opening of the slot die applicator, the substrate carrier comprising:
• a non-compliant support surface;
• and
• a compliant pattern element, wherein the compliant pattern element includes a pattern surface, and wherein the compliant pattern element protrudes outward relative to the non-compliant support surface to define a first minimum distance, R1, between the pattern surface and the non-compliant support surface;
• a base surface, wherein the pattern element protrudes outward from the base surface to define a distance, Hp, between the pattern surface and the base surface;
• and
• wherein the base surface comprises a continuous surface and wherein a plurality of discrete pattern elements are separated from each other by the continuous surface;
• wherein the substrate carrier is positioned adjacent the slot die applicator to define a minimum distance, Hg, between the pattern surface of the pattern element and the first lip and the second lip that is less than the unconstrained caliper, Hs, of the substrate;
• wherein as the substrate carrier advances the second surface of the substrate past the slot opening, the compliant pattern element is advanced such that the pattern surface repeatedly advances past the first lip, the slot opening, and the second lip of the slot die applicator;
• and
• wherein the pattern surface is deflected away from the slot die applicator as the pattern surface advances along the first lip, the slot opening, and the second lip of the slot die applicator to define a second minimum distance, R2, between the pattern surface and the non-compliant support surface, such that R2 is less than R1.