Circuit module and method of producing the same

A circuit module, comprising:

• a wiring substrate having a mount surface, a conductor pattern, and an insulating protective layer, the mount surface having a first area and a second area, the conductor pattern being formed along a boundary between the first area and the second area on the mount surface, the insulating protective layer being formed on the whole area of the mount surface, the conductor pattern including a first metal layer and a second metal layer having a laser reflectance property higher than that of the first metal layer being formed on a surface of the first metal layer, the insulating protective layer covering the mount surface and the conductor pattern;
• a plurality of electronic components mounted on the first area and the second area;
• an insulating sealing layer having a trench, the insulating sealing layer covering the plurality of electronic components and the protective layer, the trench having a depth such that the trench penetrates the protective layer to reach a surface of the conductor pattern;
• and
• a conductive shield having a first shield portion and a second shield portion, the first shield portion covering an outer surface of the sealing layer, the second shield portion being electrically connected to the conductor pattern.