Back to results
US 9,807,914 B2Granted
Power module
AssigneeIndustrial Technology Research Institute
InventorsChun-Kai Liu, Yu-Lin Chao
Life of this patent
Estimating the term…
Abstract
A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
Claims14
A power module, comprising:
- a plurality of substrates, located on different planes and surrounding an axis, wherein each of the substrates extends along the axis;
- a plurality of power devices, disposed on the substrates respectively and electrically connected with each other;
- and
- a heat dissipation assembly, disposed on the substrates and opposite to the power devices, wherein heat generated from the power devices is transferred to the heat dissipation assembly through the substrates, and the heat dissipation assembly comprises:
- a main channel, located on and extending along the axis, wherein the main channel has an inlet and an outlet;
- a plurality of first branch channels, directly connected to the inlet or the outlet of the main channel;
- and
- a plurality of second branch channels, respectively formed on one side of the substrates opposite to the power devices and connected between the inlet and the outlet of the main channel through the first branch channels, wherein each of the first branch channels has one end connected to the main channel and another end connected to an end of the one of the second branch channels.
5 more elements
Dependencies are inferred from the claim text.