Adapter cooling apparatus and method for modular computing devices

A system comprising:

• a modular computing device having a form that complies with VITA 59, the modular computing device having interfaces for coupling to a base board, the modular computing device including a circuit board with two opposing mountable surface areas, including a first surface area and a second surface area, for placement of a plurality of integrated circuit (IC) components, wherein when in an assembled configuration with the base board, the circuit board of the modular computing device is stacked with the base board such that the second surface area is proximal to the base board and the first surface is distal to the base board;
• a first cooling member comprising a first base structure having a first cooling surface for coupling to a cooling surface of an external heat sink, the first base structure being fixably positioned proximal to the first surface area of the circuit board so as to form direct thermal conduction with surfaces associated with one or more IC components, of the plurality of IC components, mounted on the first surface area of the modular computing device;
• a second cooling member comprising a second base structure that is fixably positioned proximal to the second surface area of the circuit board so as to form direct thermal conduction with surfaces associated with one or more IC components, of the plurality of IC components, mounted on the second surface area of the modular computing device, the second member comprising a plurality of side walls extending from the second base structure, each side wall including a second cooling surface and a wall contact surface, wherein when in the assembled configuration with the first cooling member and the modular computing device, each side wall of the second cooling member is proximately positionable with respect to the first cooling member such that the wall contact surface forms direct thermal conduction therewith and such that each of the first cooling surface of the first cooling member and the second cooling surface of the second cooling member forms direct thermal conduction with the cooling surface of the external heat sink;
• and
• a plurality of attachment members to couple the base board of the modular computing component, the first cooling member, and the second cooling member together as a modular assembly, and to couple the modular assembly to the external heat sink,
• wherein, prior to the one or more attachment members being coupled to the external heat sink, the modular assembly includes a spatial gap between the first cooling surface of the first base structure of the first member and the cooling surface of the external heat sink when the modular assembly is disposed on the cooling surface of the external heat sink;
• and
• wherein the second base structure of the second member is configured to elastically deform when the one or more attached members are affixed to the external heat sink such that the first cooling surface of the first base structure of the first member directly contacts the cooling surface of the external heat sink.