Storage device
AssigneeKabushiki Kaisha Toshiba
InventorsYoshiharu Matsuda, Akitoshi Suzuki
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a storage device includes an enclosure, and a circuit board assembly in the enclosure. The circuit board assembly includes a first circuit board on which a heat-producing component is mounted, a second circuit board, a third circuit board, a first connector connecting the first and second circuit boards, a second connector connecting the second and third circuit boards, a first spacer sandwiched between the first and second circuit boards, and a second spacer sandwiched between the second and third circuit boards. The first spacer includes a spacer frame, a partition member opposed to the heat-producing component with a gap between, and a thermal transfer member attached to the partition member and in contact with the first circuit board.
Claims17
A storage device comprising:
- an enclosure;
- and
- a circuit board assembly accommodated in the enclosure,
- the circuit board assembly comprising:
- a first circuit board on which a memory device and a heat-producing component are mounted;
- a second circuit board opposed to the first circuit board, on which a memory device is mounted;
- a first connector provided between the first circuit board and the second circuit board and connecting the first circuit board to the second circuit board;
- and
- a frame-shaped first spacer sandwiched between the first circuit board and the second circuit board;
- wherein
- the first spacer comprises:
- a spacer frame;
- a partition member extending from the spacer frame and opposed to the heat-producing component with a gap between;
- a thermal transfer member attached to the partition member and in contact with the first circuit board;
- a support beam coupled to the spacer frame;
- and
- a support body provided in the support beam, the partition member comprising a partition beam coupled to the spacer frame and the support beam.
A storage device comprising:
- an enclosure;
- and
- a circuit board assembly accommodated in the enclosure,
- the circuit board assembly comprising:
- a first circuit board on which a memory device and a heat-producing component are mounted;
- a second circuit board opposed to the first circuit board, on which a memory device is mounted;
- a first connector provided between the first circuit board and the second circuit board and connecting the first circuit board to the second circuit board;
- and
- a first spacer sandwiched between the first circuit board and the second circuit board;
- wherein
- the first spacer comprises:
- a spacer frame;
- a partition plate coupled to the spacer frame, extending from the spacer frame, and opposed to the first circuit board and the heat-producing component with a gap between;
- and
- a thermal transfer member attached to the partition plate and in contact with the first circuit board.
Dependencies are inferred from the claim text.