Glass system for hermetically joining Cu components, and housing for electronic components
AssigneeSchott AG
InventorsRobert Hettler, Matthias Rindt
Life of this patent
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Abstract
An housing for electronic components, such as LEDs and/or FETs, is provided. The housing has a base body having an upper surface that at least partially defines a mounting area for an electronic functional element, such that the base body provides a heat sink for the electronic functional element. The base body has a lower surface and a lateral surface and includes a connecting body for the electronic functional element, which is joined to the base body a glass layer formed by an alkali titanium silicate glass.
Claims32
A housing for accommodating an electronic functional element, comprising:
- a base body comprising an upper surface, a lower surface, and a lateral surface, the body having a boundary surface, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element;
- a connecting body made of metal;
- a glass layer that connects the base body to the connecting body so that the connecting body is electrically insulated from the base body,
- wherein the at least one glass layer is formed by an alkali titanium silicate glass having a composition in weight percent of TiO2 greater than 25%.
A housing for accommodating an electronic functional element, comprising:
- a base body comprising an upper surface, a lower surface, and a lateral surface, wherein the base body has a boundary surface, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element;
- a connecting body made of metal;
- and
- a glass layer that connects the base body to the connecting body so that the connecting body is electrically insulated from the base body;
- and
- an insulation applied at least to the lower surface of the base body,
- wherein the glass layer is formed by an alkali titanium silicate glass.
A housing for accommodating an electronic functional element, comprising:
- a base body comprising an upper surface, a lower surface, a lateral surface, a boundary surface, and at least one channel, wherein the boundary surface comprises copper oxide, and wherein the upper surface at least partially defines a mounting area for the electronic functional element so that said base body forms a heat sink for the electronic functional element;
- at least one connecting body made of metal arranged in the at least one channel;
- and
- glass at least partially filling the at least one channel to join the base body to the at least one connecting body, so that the connecting body is electrically insulated from the base body, wherein the glass has a composition comprising, in weight percent, TiO2 of greater than 25%.
Dependencies are inferred from the claim text.