Method of mounting electronic component to circuit board
AssigneesOsaka University, Senju Metal Industry Co., Ltd.
InventorsKozo Fujimoto, Shinji Fukumoto, Michiya Matsushima, Satoshi Watanabe, Takeshi Kan, Minoru Ueshima, Takeshi Sakamoto, Shu Inoue
Life of this patent
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Abstract
An method of mounting electronic component includes: providing a connecting layer between a wiring and an electronic component, the connecting layer including a conductive layer formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent and one or two layers of a thermoplastic resin layer formed of thermoplastic resin; and electrically connecting the electronic component to the wiring through the connecting layer.
Claims2
A method of mounting electronic component, the method comprising the steps of:
- providing a conductive layer on at least one wiring disposed on a surface of a printed wiring board, the conductive layer being formed of a solder powder-containing resin composition containing thermosetting resin, solder powder, and a reducing agent;
- providing a thermoplastic resin layer, which is formed of thermoplastic resin, on the conductive layer such that the thermoplastic resin layer covers the conductive layer, and directly on a portion of the surface of the printed wiring board positioned next to the wiring in a direction parallel with the surface of the printed wiring board;
- disposing an electronic component on the conductive layer such that the thermoplastic resin layer is positioned between the conductive layer and the electronic component;
- and
- electrically connecting the electronic component to the wiring through the conductive layer by heating the conductive layer and the thermoplastic resin layer to a melting point or higher of the solder powder.
Dependencies are inferred from the claim text.