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US 9,807,888 B2Granted
Conducting package structure and manufacturing method thereof
AssigneeTai-Saw Technology Co., Ltd.
InventorsYu-Tung Huang, Ming-Hung Chang
Life of this patent
Estimating the term…
Abstract
A conducting package structure includes a substrate and a conducting material. The conducting material is formed to a first patterned structure. The first patterned structure has a first surface which is connected to the substrate and a patterned second surface opposite to the first surface.
Claims14
A conducting package structure, comprising:
- a substrate;
- and
- a conducting structure having a first surface disposed on the substrate and a second surface formed with a plurality of guide rods, a first auxiliary structure including a plurality of cylinders and a plurality of triangular pyramids and a second auxiliary structure including a plurality of concentrically circular pieces, wherein any two adjacent guide rods have therebetween a distance larger than two times of a width of either of the any two adjacent guide rods, and the first auxiliary structure is configured to accelerate a volatilization of a solvent of a glue material disposed on the second surface.
A conducting package structure, comprising:
- a substrate;
- and
- a conducting material formed with a first patterned structure, wherein the first patterned structure has a first surface disposed on the substrate and a second surface opposite to the first surface, the second surface is formed with a first auxiliary structure including a plurality of cylinders and a plurality of triangular pyramids and configured to accelerate a volatilization of a solvent of a glue material disposed on the second surface, and a second auxiliary structure configured to retard a diffusion of the solvent of the glue material.
A conducting package structure, comprising:
- a substrate;
- and
- a conducting structure having a first surface disposed on the substrate and a second surface formed with a first auxiliary structure including a plurality of cylinders and a plurality of triangular pyramids, wherein two adjacent rows of the cylinders are disposed between respective adjacent two of the plurality of triangular pyramids, and the first auxiliary structure is configured to accelerate a volatilization of a solvent of a glue material disposed on the second surface.
Dependencies are inferred from the claim text.