Electronic circuit and method of fabricating the same

A method of fabricating an electronic circuit using a mother substrate, comprising:

• providing a substrate including an interconnection region and a device region;
• forming a conductive line on an upper surface of the substrate in the interconnection region and forming an electronic device on the upper surface of the substrate in the device region;
• and
• forming a capping layer on the substrate,
• wherein the interconnection region has an uneven portion,
• wherein the device region is flat,
• wherein the electronic device and the conductive line are embedded between the substrate and the capping layer,
• wherein the electronic device and the conductive line are in contact with each other horizontally, and
• wherein the providing of the substrate comprises:
• coating the mother substrate with an elastic polymer including a photoinitiator to form the substrate;
• and
• forming the uneven portion by using a grayscale photomask.

A method of fabricating an electronic circuit using a mother substrate, comprising:

• providing a substrate including an interconnection region and a device region;
• forming a conductive line on an upper surface of the substrate in the interconnection region and forming an electronic device on the upper surface of the substrate in the device region;
• and
• forming a capping layer on the substrate,
• wherein the interconnection region has an uneven portion,
• wherein the device region is flat,
• wherein the electronic device and the conductive line are embedded between the substrate and the capping layer,
• wherein the electronic device and the conductive line are in contact with each other horizontally, and
• wherein the providing of the substrate comprises:
• forming a photoresist layer including a first region and a second region on the mother substrate;
• forming a square pattern in the first region;
• forming a round pattern by reflowing the photoresist layer;
• coating the photoresist layer with an elastic polymer;
• and
• forming the substrate by separating the elastic polymer from the mother substrate and the photoresist layer.

A method of fabricating an electronic circuit using a mother substrate, comprising:

• providing a substrate including an interconnection region and a device region;
• forming a conductive line in the interconnection region and forming an electronic device in the device region;
• and
• forming a capping layer on the substrate,
• wherein the interconnection region has an uneven portion,
• wherein the device region is flat, and
• wherein the providing of the substrate comprises:
• coating the mother substrate with an elastic polymer including a photoinitiator to form the substrate;
• and
• forming the uneven portion by using a grayscale photomask.

A method of fabricating an electronic circuit using a mother substrate, comprising:

• providing a substrate including an interconnection region and a device region;
• forming a conductive line in the interconnection region and forming an electronic device in the device region;
• and
• forming a capping layer on the substrate,
• wherein the interconnection region has an uneven portion,
• wherein the device region is flat,
• wherein the electronic device and the conductive line are embedded between the substrate and the capping layer, and
• wherein the providing of the substrate comprises:
• forming a photoresist layer including a first region and a second region on the mother substrate;
• forming a square pattern in the first region;
• forming a round pattern by reflowing the photoresist layer;
• coating the photoresist layer with an elastic polymer;
• and
• forming the substrate by separating the elastic polymer from the mother substrate and the photoresist layer.