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US 9,807,881 B2Granted
Semiconductor device
AssigneeSamsung Electronics Co., Ltd.
InventorYoung-Jin Cho
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the first circuit and the second circuit to each other, a substrate on which the semiconductor chip is disposed, and substrate wirings that are arranged on the substrate and electrically connect the first circuit and the second circuit to each other.
Claims19
A semiconductor device comprising:
- a semiconductor chip comprising a first internal wiring, a first connection pad that is electrically connected to the first internal wiring and exposed to an outside of the semiconductor chip, and a first input pad that is spaced apart from the first connection pad;
- a substrate on which the semiconductor chip is disposed;
- and
- a first substrate wiring that is arranged on the substrate and electrically connects the first connection pad and the first input pad to each other,
- wherein the semiconductor chip further comprises:
- a second internal wiring that is spaced apart from the first internal wiring and extends in parallel to the first internal wiring;
- a second connection pad that is electrically connected to the second internal wiring and exposed to outside;
- and
- a second input pad that is spaced apart from the second connection pad, and
- wherein the semiconductor device further comprises a second substrate wiring that is arranged on the substrate and electrically connects the second connection pad and the second input pad to each other.
7 more elements
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted on the substrate, the semiconductor chip comprising:
- a plurality of unit cells spaced apart from one another;
- a plurality of input pads;
- a first internal wiring electrically connected to each of the plurality of unit cells;
- a second internal wiring electrically connected to each of the plurality of unit cells, the second internal wiring spaced apart from the first internal wiring;
- a first connection pad exposed on a surface of the semiconductor chip and electrically connected to the first internal wiring;
- and
- a second connection pad exposed on the surface of the semiconductor chip and electrically connected to the second internal wiring;
- a first substrate wiring formed on the substrate that electrically connects the first connection pad to at least one first input pad of the plurality of input pads;
- and
- a second substrate wiring formed on the substrate that electrically connects the second connection pad to at least one second input pad of the plurality of input pads.
9 more elements
A semiconductor device comprising:
- a substrate;
- a semiconductor chip mounted on the substrate, the semiconductor chip comprising:
- a plurality of unit cells spaced apart from one another;
- a plurality of input pads arranged along an edge of the semiconductor chip and spaced apart from one another;
- a first internal wiring electrically connected to each of the plurality of unit cells;
- a second internal wiring electrically connected to each of the plurality of unit cells, the second internal wiring spaced apart from the first internal wiring;
- a first substrate wiring formed on the substrate that electrically connects the first internal wiring to a first input pad and a second input pad of the plurality of input pads;
- and
- a second substrate wiring formed on the substrate that electrically connects the second internal wiring to at least one input pad of the plurality of input pads that is arranged between the first input pad and the second input pad.
6 more elements
Dependencies are inferred from the claim text.