Shielding mold for electric and magnetic EMI mitigation

Abstract

An electronic package having a substrate that includes signal traces and ground traces; an electronic component mounted on an upper surface of the substrate such that the electronic component is electrically connected to the signal traces and the ground traces in the substrate; an insulating layer covering the electronic component and the upper surface of the substrate; and an electromagnetic interference shielding mold covering the insulation layer such that the electromagnetic interference shielding mold is electrically connected to the ground traces in the substrate. In some forms of the electronic package, the electromagnetic interference shielding mold is electrically connected to the ground traces through openings in the insulation layer.

Dependencies are inferred from the claim text.