MEMS microphone package
AssigneeAac Acoustic Technologies (Shenzhen) Co., Ltd.
InventorsChao Wang, Bin Xu
Life of this patent
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Abstract
A micro-electro-mechanical system (MEMS) microphone package is provided in the present disclosure. The MEMS microphone package includes a circuit board, an electromagnetic shielding cover mounted on the circuit board to define an accommodating space, electronic components received in the accommodating space and electrically connected to the circuit board, and a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board. The shielding ring is configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board.
Claims10
A micro-electro-mechanical system (MEMS) microphone package, comprising:
- a circuit board;
- an electromagnetic shielding cover mounted on the circuit board to define an accommodating space;
- electronic components received in the accommodating space and electrically connected to the circuit board;
- and
- a shielding ring covering a joint between the electromagnetic shielding cover and the circuit board, the shielding ring being configured for preventing electromagnetic waves from entering the accommodating space via the joint between the electromagnetic shielding cover and the circuit board;
- wherein,
- the shielding ring is arranged outside the accommodating space and has a hollow truncated cone structure with a top portion and a bottom portion, and a through hole is formed at the shielding ring and extends from the top portion to the bottom portion;
- and
- the top portion of the shielding ring has a diameter less than that of the bottom portion of the shielding ring.
Dependencies are inferred from the claim text.