Printed circuit board having high-speed or high-frequency signal connector

A printed circuit board having a high-frequency signal connector, the board comprising:

• a substrate comprising a surface layer, a first ground layer, a second ground layer, and a bottom layer that are laminated in sequence;
• a high-frequency signal receiving portion formed in the surface layer of the substrate;
• a plurality of high-frequency signal connector mounting portions formed in the surface layer of the substrate;
• a plurality of high-frequency signal lines formed in the surface layer of the substrate, the plurality of high-frequency signal lines extend from the high-frequency signal receiving portion to the plurality of high-frequency signal connector mounting portions;
• and
• a plurality of high-frequency signal connectors disposed in the plurality of high-frequency signal connector mounting portions, each of the plurality of high-frequency signal connectors comprising a signal terminal connected to each of the plurality of high-frequency signal lines,
• wherein the substrate comprises a plurality of vias that connect the first ground layer positioned below the plurality of high-frequency signal connector mounting portions and the second ground layer positioned below the first ground layer,
• wherein an end of the first ground layer, an end of the second ground layer, and cutting surfaces of some of the plurality of vias are exposed to a side surface of the substrate, and
• wherein when the plurality of high-frequency signal connectors are disposed on the plurality of high-frequency signal connector mounting portions, a ground of each of the plurality of high-frequency signal connectors is in contact with the end of the first ground layer, the end of the second ground layer, and the cutting surfaces of some of the plurality of vias that are exposed to the side surface of the substrate.