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US 9,806,422 B2Granted
Antenna-in-package structures with broadside and end-fire radiations
AssigneeInternational Business Machines Corporation
InventorsAlberto V. Garcia, Xiaoxiong Gu, Duixian Liu
Life of this patent
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Abstract
Package structures are provided having antenna-in-packages that are integrated with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter wave (mmWave) frequency range with radiation in broadside and end-fire directions.
Claims20
A package structure, comprising:
- an antenna package comprising a plurality of stacked substrates comprising a first substrate and a second substrate, and metallization layers including a first metallization layer formed on a first surface of the first substrate, and a second metallization layer formed on first surface of the second substrate, wherein the first metallization layer comprises a first planar antenna and a planar parasitic element disposed adjacent to the first planar antenna, and wherein the second metallization layer comprises a second planar antenna;
- an RFIC (radio frequency integrated circuit) chip flip-chip bonded to the second metallization layer on the first surface of the second substrate of the antenna package;
- a first antenna feed line which comprises a metalized via hole that extends through the plurality of substrates from the first surface of the second substrate to the first surface of the first substrate, wherein the first planar antenna is connected to the RFIC chip by the first antenna feed line;
- a second antenna feed line formed as part of the second metallization layer on the first surface of the second substrate, wherein the second antenna feed line extends along the first surface of the second substrate to connect the second planar antenna to the RFIC chip;
- wherein the first planar antenna is configured to receive or transmit broadside signals and the second planar antenna is configured to receive or transmit end-fire signals;
- and
- wherein the planar parasitic element is configured to reduce surface waves on the first surface of the first substrate.
4 more elements
An antenna package, comprising:
- an antenna package comprising a plurality of stacked substrates comprising a first substrate and a second substrate, and metallization layers including a first metallization layer formed on a first surface of the first substrate, and a second metallization layer formed on first surface of the second substrate, wherein the first metallization layer comprises a first planar antenna and a planar parasitic element disposed adjacent to the first planar antenna, and wherein the second metallization layer comprises a second planar antenna;
- a first antenna feed line which comprises a metalized via hole that extends through the plurality of substrates from the first surface of the second substrate to the first surface of the first substrate, wherein the first planar antenna is connected to the first antenna feed line;
- a second antenna feed line formed as part of the second metallization layer on the first surface of the second substrate, wherein the second antenna feed line extends along the first surface of the second substrate and is coupled to the second planar antenna on the first surface of the second substrate;
- wherein the first planar antenna is configured to receive or transmit broadside signals and the second planar antenna is configured to receive or transmit end-fire signals;
- and
- wherein the planar parasitic element is configured to reduce surface waves on the first surface of the first substrate.
3 more elements
Dependencies are inferred from the claim text.