Crosstalk, power supply noise and/or EMI reduction methods and apparatuses
AssigneeIntel Corporation
InventorsShaowu Huang, Hanqiao Zhang, Kai Xiao, Beom-Taek Lee, John J. Abbott, Gary Charles
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AssigneeIntel Corporation
InventorsShaowu Huang, Hanqiao Zhang, Kai Xiao, Beom-Taek Lee, John J. Abbott, Gary Charles
Estimating the term…
Apparatuses and methods associated with shield lines, and/or complementary decoupling capacitors and/or electromagnetic absorbing materials are disclosed herein. In embodiments, an apparatus may include a substrate having a ground plane; and a first and a second transmission line disposed on the substrate. Further, the apparatus may include a shield line constituted with electromagnetic absorbing material disposed between the first and second transmission lines and not coupled with the ground plane. In embodiments, the substrate may further include a power plane having a plurality of edges and a plurality of spacing; a plurality of decoupling capacitors disposed on the power or ground plane; and electromagnetic absorbing materials adhered to the plurality of edges and disposed in the plurality of spacing. Other embodiments may be described and/or claimed.
An apparatus, comprising:
A method, comprising:
Dependencies are inferred from the claim text.