Radio frequency die package with inverted ground plane and method of making same
AssigneeGeneral Electric Company
InventorsYongjae Lee, Joseph Alfred Iannotti, Christopher Fred Keimel, Christopher James Kapusta
Life of this patent
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Abstract
A radio frequency (RF) die package includes a switch assembly comprising an RF transmission line and a plurality of conductive mounting pads formed on a first substrate. A switching mechanism selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line. An inverted ground plane assembly is coupled to the plurality of conductive mounting pads such that an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
Claims20
A radio frequency (RF) die package comprising:
- a switch assembly comprising:
- an RF transmission line and a plurality of conductive mounting pads formed on a first substrate;
- and
- a switching mechanism that selectively couples a first portion of the RF transmission line to a second portion of the RF transmission line;
- and
- an inverted ground plane assembly coupled to the plurality of conductive mounting pads;
- wherein an electromagnetic field generated between the RF transmission line and the inverted ground plane assembly does not permeate the first substrate in a region of the switch assembly proximate the switching mechanism.
A method of manufacturing a radio frequency (RF) die package comprising:
- providing a die assembly comprising a plurality of conductive mounting pads and an RF transmission line and disposed on a first mounting substrate, the RF transmission line having a switching device positioned thereon;
- and
- coupling a ground plane assembly to the die assembly with at least one conductive contact such that an electromagnetic field generated between the RF transmission line and the ground plane assembly extends through a cavity formed between the ground assembly and the die assembly and does not permeate the first mounting substrate in a region proximate the switching device.
A radio frequency (RF) die package comprising:
- a die assembly comprising:
- a first substrate;
- a signal line disposed on the first substrate;
- a switching mechanism configured to electrically couple a first portion of the signal line to a second portion of the signal line when in a closed position and electrically isolate the first portion from the second portion when in an open position;
- and
- a plurality of conductive pads disposed on the first substrate;
- an inverted ground plane assembly comprising:
- a second substrate;
- and
- a ground plane coupled to a surface of the second substrate facing the signal line;
- and
- at least one contact electrically and mechanically coupling the ground plane to the plurality of conductive pads.
Dependencies are inferred from the claim text.