Encapsulation film

An encapsulating film for an organic electronic device, comprising:

• a first layer including a resin component wherein the resin component is a material selected from the group consisting of a styrene-based resin, a polyolefin-based resin, a thermoplastic elastomer, a polyoxyalkylene-based resin, a polyester-based resin, a polyvinyl chloride-based resin, a polycarbonate-based resin, a polyphenylenesulfide-based resin, a mixture of hydrocarbons, a polyamide-based resin, an acrylate-based resin, a silicon-based resin, a fluorine-based resin and a mixture thereof, and a moisture scavenger of 30 parts by weight to 250 parts by weight with respect to 100 parts by weight of the resin component, and having a tensile modulus of 0.001 to 100 MPa measured at 25° C. after being cured;
• and
• a second layer including a curable resin composition and a moisture scavenger at 0 parts by weight or more and less than 5 parts by weight with respect to 100 parts by weight of a solid content of the second layer,
• wherein the encapsulating film is arranged such that when placed on the organic electronic diode the second layer is in physical contact with the organic electronic diode, and the first layer is not in physical contact with the organic electronic diode,
• wherein the tensile modulus of the first layer measured at 25° C. after being cured is lower than the tensile modulus of the second layer measured at 25° C. after being cured, and
• wherein the first layer is a pressure-sensitive adhesive layer or an adhesive layer.