OLED packaging method, packaged structure and display device
AssigneeBoe Technology Group Co., Ltd.
InventorsWenfeng Song, Chunjan Wang, Donghui Yu
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Abstract
An OLED packaging method, a packaged structure, and a display device are disclosed. The packaging method comprises forming at least one group of films on an OLED to be packaged. Each group of films comprises three films, and an intermediate film in each group of films is an intermediate inorganic-organic hybrid layer. The intermediate inorganic-organic hybrid layer is arranged as an intermediate film in each group of films, and connects an upper film and a lower film in each group of films, so that adhesion between the upper film and the lower film in each group of films is effectively improved, and stripping of the upper and lower films is avoided.
Claims9
An OLED packaging method comprising:
- forming at least one group of films on an OLED to be packaged, wherein each group of films comprises three films, and an intermediate film in each group of films is an intermediate inorganic-organic hybrid layer,
- wherein forming at least one group of films on the OLED to be packaged comprises:
- transferring the OLED to be packaged into an ALD processing chamber;
- and
- depositing at least one group of films on the OLED to be packaged by means of ALD technology in the ALD processing chamber,
- wherein during depositing the intermediate inorganic-organic hybrid layer in each group of films, successively introducing an inorganic precursor, an inert gas, an oxidizing agent, an inert gas, an organic precursor, and an inert gas into the ALD processing chamber to complete one period of intermediate inorganic-organic hybrid layer deposition;
- and
- repeating the one period of intermediate inorganic-organic hybrid layer deposition, until the intermediate inorganic-organic hybrid layer reaches a second predefined thickness.
Dependencies are inferred from the claim text.