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US 9,806,287 B2Granted
Encapsulation film and method for encapsulating organic electronic device using same
AssigneeLG Chem, Ltd.
InventorsHyun Jee Yoo, Hyun Suk Kim, Suk Ky Chang, Seung Min Lee, Jung Ok Moon
Life of this patent
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Abstract
Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, prevent adhesion failure and damage to an organic film due to volume expansion occurring by a reaction between a moisture adsorbent and moisture, and provide high reliability due to increases in a lifespan and durability of the OED.
Claims19
An encapsulation film for encapsulating an organic electronic device, comprising:
- an encapsulating layer comprising a crack barrier layer having a tensile modulus of 0.001 to 500 mpa at room temperature and a moisture barrier layer having a tensile modulus of 500 to 1000 mpa at room temperature, of which the crack barrier layer is formed to be in contact with the organic electronic device upon encapsulation of the organic electronic device,
- wherein the crack barrier layer and the moisture barrier layer comprise an encapsulation resin or a moisture adsorbent.
Dependencies are inferred from the claim text.