Organic light-emitting diode display and manufacturing method thereof

A method of manufacturing an organic light-emitting diode (OLED) display, the method comprising:

• forming a first substrate having a display area and a peripheral area surrounding the display area;
• forming a first insulation layer on the peripheral area of the first substrate;
• forming a metal layer on the first insulation layer;
• forming a second insulation layer on the metal layer;
• forming a first through hole through the first insulation layer, the metal layer and the second insulation layer;
• forming a second through hole having a width different from that of the first through hole in the metal layer;
• and
• filling the first and second through holes with a sealing material so as to seal the first substrate to a second substrate.

An organic light-emitting diode (OLED) display comprising:

• a first substrate including a display area and a peripheral area, the display area including a transistor driving for an organic light-emitting diode;
• a second substrate facing the first substrate;
• a sealing member disposed between the peripheral area of the first substrate and the second substrate;
• and
• a first insulation layer disposed on the peripheral area and comprising at least one first through hole,
• a metal layer disposed on the first insulation layer and comprising at least one second through hole overlapping at least one portion of the first through hole;
• and
• a second insulation layer disposed on the metal layer and comprising at least one third through hole overlapping at least one portion of the second through hole,
• wherein the metal layer is formed of the same material as a gate electrode of the transistor, and
• wherein the sealing member is directly in contact with the first substrate through the first, second and third through holes.

An organic light-emitting diode (OLED) display comprising:

• a first substrate including a display area and a peripheral area, the display area including a transistor driving for an organic light-emitting diode;
• a second substrate facing the first substrate;
• a sealing member disposed between the first substrate and the second substrate;
• and
• a first insulation layer, a metal layer and a second insulation layer disposed on the first substrate,
• wherein the metal layer is disposed on the first insulation layer and has at least a first through hole in the peripheral area,
• wherein the second insulation layer is disposed on the metal layer and has at least one second through hole that has a width different from that of the first through hole and a third through hole is defined in the first insulation layer and overlaps the first through hole
• wherein at least one portion of the second through hole overlaps with at least one portion of the first through hole, and wherein the sealing member fills at least one portion of each of the first, second, and third through holes.