Organic electroluminescent element having a sealing substrate, and method for producing organic electroluminescent element
AssigneeKonica Minolta, Inc.
InventorsKenji Hayashi, Koutarou Kikuchi
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Abstract
Provided is an organic EL element comprising: a gas barrier layer disposed on a substrate; a light-emitting part; an inorganic sealing layer; lead-out wiring that extends outside of the inorganic sealing layer; and a sealing substrate that is bonded via a resin adhesive layer, wherein the organic EL element is configured such that above at least the lead-out wiring, the sealing substrate is folded to the substrate side and makes contact with the inorganic sealing layer, and improvement of connection reliability with external equipment is possible.
Claims11
An organic electroluminescent element comprising:
- a substrate;
- a gas barrier layer disposed on the substrate;
- a light-emitting part disposed on the gas barrier layer and comprising a first electrode, an organic functional layer, and a second electrode;
- an inorganic sealing layer which covers the light-emitting part;
- lead-out wiring that extends outside the inorganic sealing layer and is connected with the first electrode or the second electrode;
- and
- a sealing substrate including a metal layer and an electrical insulation layer which are bonded together via a resin adhesive layer on the inorganic sealing layer,
- wherein, above at least the lead-out wiring, the sealing substrate is folded to the substrate side, and at least any one of the metal layer and the insulation layer makes contact with the inorganic sealing layer.
A method for producing an organic electroluminescent element, the method comprising the steps of:
- forming a gas barrier layer on a substrate;
- forming a light-emitting part including a first electrode, an organic functional layer, and a second electrode, on the gas barrier layer;
- forming lead-out wiring which is connected to the first electrode or the second electrode;
- forming an inorganic sealing layer which covers the light-emitting part and a part of the lead-out wiring on the light-emitting part side;
- pressure-bonding a sealing substrate by joining the sealing substrate including a metal layer and an insulation layer which are bonded together via a resin adhesive layer on the inorganic sealing layer, and by folding at least an edge portion of the sealing substrate above the lead-out wiring so that at least any one of the metal layer and the insulation layer makes contact with the inorganic sealing layer.
Dependencies are inferred from the claim text.