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US 9,806,261 B2Granted
Organic light emitting diode display
AssigneeSamsung Display Co., Ltd.
InventorsJung-Hyun Son, Hoon Kim
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Abstract
Disclosed is an organic light emitting diode (OLED) display comprising a substrate; an organic light emitting element disposed on the substrate; an encapsulation substrate disposed on the organic light emitting element; and an adhesive layer formed on the substrate, covering the organic light emitting element, and bonding the substrate on which the organic light emitting element is formed with the encapsulation substrate.
Claims12
An organic light emitting diode (OLED) display comprising
- a substrate;
- an organic light emitting element disposed on the substrate;
- an encapsulation substrate disposed on the organic light emitting element;
- and
- an adhesive layer disposed between the substrate and the encapsulation substrate, covering the organic light emitting element, and bonding the substrate with the encapsulation substrate,
- wherein the adhesive layer comprises,
- at least one filling adhesive layer contacting the organic light emitting element on at least three sides, and
- a hygroscopic adhesive layer comprising more than about 5 to about 50 parts by weight of a hygroscopic material the entirety of which does not contact the organic light emitting element,
- wherein the at least one filling adhesive layer and the hygroscopic adhesive layer include a different kind of thermally curable resin or photocurable resin, respectively, and
- wherein the at least one filling adhesive layer includes a bisphenol-based epoxy resin as the thermally curable resin or photocurable resin.
7 more elements
An organic light emitting diode (OLED) display comprising
- a substrate;
- an organic light emitting element disposed on the substrate;
- an encapsulation substrate disposed on the organic light emitting element;
- and
- an adhesive layer disposed between the substrate and the encapsulation substrate, covering the organic light emitting element, and bonding the substrate with the encapsulation substrate,
- wherein the adhesive layer comprises,
- at least one filling adhesive layer contacting the organic light emitting element on at least three sides, and
- a hygroscopic adhesive layer comprising more than about 5 to about 50 parts by weight of a hygroscopic adhesive material the entirety of which does not contact the organic light emitting element,
- wherein the at least one filling adhesive layer and the hygroscopic adhesive layer include a same kind of thermally curable resin or photocurable resin, respectively, and
- wherein the thermally curable resin or photocurable resin includes a bisphenol-based epoxy resin.
7 more elements
Dependencies are inferred from the claim text.