Vapor deposition mask, frame-equipped vapor deposition mask, and method for producing organic semiconductor element

A frame-equipped vapor deposition mask comprising:

• a frame;
• and
• a vapor deposition mask fixed to the frame, wherein the vapor deposition mask comprises:
• a metal mask having a slit;
• and
• a resin mask having a first surface, an opposed second surface, and an opening extending in a thickness direction of the resin mask from the first surface to the second surface and corresponding to a pattern to be produced by vapor deposition,
• wherein
• the metal mask is stacked on the second surface of the resin mask,
• an inner wall surface for composing the opening of the resin mask has at least one inflection point along said thickness direction,
• in the thickness direction, an intersection of the first surface and the inner wall surface is a first intersection, an intersection of the second surface and the inner wall surface is a second intersection, and the inflection point is positioned between the first intersection, and the second intersection,
• an angle (θ1), formed between a straight line connecting the first intersection and the inflection point and the first surface, is larger than an angle (θ2), formed between an imaginary extension of a straight line connecting the inflection point and the second intersection and the second surface, and
• at least a portion of the inner wall surface extends outwardly from the first surface toward the second surface in said thickness direction.

A method for producing an organic semiconductor element comprising a step of forming a vapor deposition pattern on a vapor deposition target with use of a frame-equipped vapor deposition mask including a vapor deposition mask which is fixed to a frame, wherein

• in the step of forming the vapor deposition pattern, the vapor deposition mask fixed to the frame includes:
• a metal mask in which a slit is provided;
• and a resin mask having a first surface, an opposed second surface, and an opening extending in a thickness direction of the resin mask from the first surface to the second surface and corresponding to a pattern to be produced by vapor deposition is provided, the metal mask being stacked on the second surface of the resin mask,
• an inner wall surface for composing the opening of the resin mask has at least one inflection point along said thickness direction, and wherein
• in the thickness direction, an intersection of the first surface and the inner wall surface is a first intersection, an intersection of the second surface and the inner wall surface is a second intersection, and the inflection point is positioned between the first intersection and the second intersection,
• an angle (θ1), formed between a straight line connecting the first intersection and the inflection point and the first surface, is larger than an angle (θ2), formed between an imaginary extension of a straight line connecting the inflection point and the second intersection and the second surface, and
• at least a portion of the inner wall surface extends outwardly from the first surface toward the second surface in the thickness direction.