Light emitting device package, backlight unit, and method of manufacturing light emitting device package

A backlight unit comprising:

• a light emitting device including a first pad and a second pad;
• a lead frame having a first electrode disposed at one side of an electrode separation space and a second electrode disposed at the other side of the electrode separation space, and the lead frame having the light emitting device seated thereon;
• a first bonding medium disposed between the first pad and the first electrode such that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other;
• a second bonding medium disposed between the second pad and the second electrode such that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other;
• and
• a light guide plate disposed in a light path of the light emitting device,
• wherein at least one first accommodating cup part configured to accommodate the first bonding medium therein is formed in the first electrode of the lead frame, and at least one second accommodating cup part configured to accommodate the second bonding medium therein is formed in the second electrode of the lead frame,
• wherein a width or a length of an inlet of the at least one first accommodating cup part is smaller than a width or a length of the first pad of the light emitting device and a width or a length of an inlet of the at least one second accommodating cup part is smaller than a width or a length of the second pad of the light emitting device such that one portion of the first pad of the light emitting device directly contacts the first electrode of the lead frame and one portion of the second pad of the light emitting device directly contacts the second electrode of the lead frame, and
• wherein the first bonding medium is housed in the at least one first accommodating cup part so that the one portion of the first pad of the light emitting device can be directly contacted to the first electrode of the lead frame, and the second bonding medium is housed in the at least one second accommodating cup part so that the one portion of the second pad of the light emitting device can be directly contacted to the second electrode of the lead frame.

A method of manufacturing a light emitting device package, the light emitting device package including:

• a light emitting device having a first pad and a second pad;
• a lead frame having a first electrode disposed at one side of an electrode separation space and a second electrode disposed at the other side of the electrode separation space;
• a first bonding medium disposed between the first pad of the light emitting device and the first electrode of the lead frame so that the first pad of the light emitting device and the first electrode of the lead frame are electrically connected to each other;
• and a second bonding medium disposed between the second pad of the light emitting device and the second electrode of the lead frame so that the second pad of the light emitting device and the second electrode of the lead frame are electrically connected to each other, the method comprising:
• preparing the lead frame in which at least one first accommodating cup part configured to accommodate the first bonding medium therein is formed in the first electrode of the lead frame and at least one second accommodating cup part configured to accommodate the second bonding medium therein is formed in the second electrode of the lead frame;
• applying or dispensing the first bonding medium onto the at least one first accommodating cup part and applying or dispensing the second bonding medium onto the at least one second accommodating cup part;
• seating the light emitting device on the lead frame such that one portion of the first pad of the light emitting device directly contacts the first electrode of the lead frame and the other portion of the first pad of the light emitting device is electrically connected to the first bonding medium and one portion of the second pad of the light emitting device directly contacts the second electrode of the lead frame and the other portion of the second pad of the light emitting device is electrically connected to the second bonding medium;
• and
• allowing the first bonding medium and the second bonding medium to reflow,
• wherein a width or a length of an inlet of the at least one first accommodating cup part is smaller than a width or a length of the first pad of the light emitting device and a width or a length of an inlet of the at least one second accommodating cup part is smaller than a width or a length of the second pad of the light emitting device, such that the one portion of the first pad of the light emitting device directly contacts the first electrode of the lead frame and the one portion of the second pad of the light emitting device directly contacts the second electrode of the lead frame, and
• wherein the first bonding medium is housed in the at least one first accommodating cup part so that the one portion of the first pad of the light emitting device can be directly contacted to the first electrode of the lead frame, and the second bonding medium is housed in the at least one second accommodating cup part so that the one portion of the second pad of the light emitting device can be directly contacted to the second electrode of the lead frame.