Optoelectronic component and method for producing an optoelectronic component

A method for producing an optoelectronic component, the method comprising:

• providing a carrier body,
• forming an optoelectronic layer structure having at least one contact region for electrically contacting the optoelectronic layer structure above the carrier body,
• arranging a covering body above the optoelectronic layer structure,
• before or after arranging the covering body, forming at least one contact cutout in the carrier body and/or the covering body in such a way that it extends through the carrier body and/or the covering body and that at least one part of the contact region is exposed in it,
• arranging a contact medium in the contact cutout,
• for the purpose of electrically contacting the optoelectronic component arranging at least one plug element at least partly in the contact cutout in such a way that it tightly closes the contact cutout, that the contact cutout is sealed by the plug element, and that it is electrically coupled to the contact region via the contact medium.