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US 9,806,241 B2Granted
Resin-attached lead frame and semiconductor device
AssigneeDai Nippon Printing Co., Ltd.
InventorsChikao Ikenaga, Kazunori Oda
Life of this patent
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Abstract
A resin-attached lead frame and a semiconductor device including the resin-attached lead frame. The resin-attached lead frame includes a lead frame main body having a die pad (LED element resting portion) and a lead portion disposed apart from the die pad. The lead frame main body further includes an LED element resting region formed over an area including an upper surface of the die pad and an upper surface of the lead portion. A reflecting resin section surrounds the LED element resting region of the lead frame main body. A vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body.
Claims8
A resin-attached lead frame, comprising:
- a lead frame main body including:
- an LED element resting portion;
- a lead portion disposed apart from the LED element resting portion;
- and
- an LED element resting region formed over an area including an upper surface of the LED element resting portion and an upper surface of the lead portion;
- and
- a reflecting resin section surrounding the LED element resting region of the lead frame main body;
- wherein
- a vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body;
- and
- a non-through groove for enhancing adhesion between the lead frame main body and the reflecting resin section is formed along an outer edge of the LED element resting region on an upper surface of the lead frame main body.
8 more elements
A resin-attached lead frame, comprising:
- a lead frame main body including:
- an LED element resting portion;
- a lead portion disposed apart from the LED element resting portion;
- and
- an LED element resting region formed over an area including an upper surface of the LED element resting portion and an upper surface of the lead portion;
- and
- a reflecting resin section surrounding the LED element resting region of the lead frame main body;
- wherein
- a vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body;
- and
- the vapor-deposited aluminum layer or the sputtered aluminum layer is formed on the lead frame main body via a bonding layer formed of a layer plated with silver.
8 more elements
A resin-attached lead frame, comprising:
- a lead frame main body including:
- an LED element resting portion;
- a lead portion disposed apart from the LED element resting portion;
- and
- an LED element resting region formed over an area including an upper surface of the LED element resting portion and an upper surface of the lead portion;
- and
- a reflecting resin section surrounding the LED element resting region of the lead frame main body;
- wherein
- a vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body, and is further provided on an inner wall of the reflecting resin section and at least a part of an upper surface of the reflecting resin section;
- and
- the vapor-deposited aluminum layer or the sputtered aluminum layer is continuously formed from the upper surface of the LED element resting region to an upper end of the inner wall of the reflecting resin section via a lower end of the inner wall of the reflecting resin section.
8 more elements
A semiconductor device, comprising:
- a lead frame main body including;
- an LED element resting portion;
- a lead portion disposed apart from the LED element resting portion;
- and
- an LED element resting region formed over an area including an upper surface of the LED element resting portion and an upper surface of the lead portion;
- a reflecting resin section surrounding the LED element resting region of the lead frame main body;
- an LED element resting on the LED element resting portion of the lead frame main body;
- an electric conductor electrically interconnecting the LED element and the lead portion of the lead frame main body;
- and
- a sealing resin sealing the LED element and the electric conductor;
- wherein
- a vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body;
- and
- a non-through groove for enhancing adhesion between the lead frame main body and the reflecting resin section is formed along an outer edge of the LED element resting region on an upper surface of the lead frame main body.
11 more elements
A semiconductor device, comprising:
- a lead frame main body including:
- an LED element resting portion;
- a lead portion disposed apart from the LED element resting portion;
- and
- an LED element resting region formed over an area including an upper surface of the LED element resting portion and an upper surface of the lead portion;
- a reflecting resin section surrounding the LED element resting region of the lead frame main body;
- an LED element resting on the LED element resting portion of the lead frame main body;
- an electric conductor electrically interconnecting the LED element and the lead portion of the lead frame main body;
- and
- a sealing resin sealing the LED element and the electric conductor;
- wherein
- a vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body;
- and
- the vapor-deposited aluminum layer or the sputtered aluminum layer is formed on the lead frame main body via a bonding layer formed of a layer plated with silver.
11 more elements
A semiconductor device, comprising:
- a lead frame main body including:
- an LED element resting portion;
- a lead portion disposed apart from the LED element resting portion;
- and
- an LED element resting region formed over an area including an upper surface of the LED element resting portion and an upper surface of the lead portion;
- a reflecting resin section surrounding the LED element resting region of the lead frame main body;
- an LED element resting on the LED element resting portion of the lead frame main body;
- an electric conductor electrically interconnecting the LED element and the lead portion of the lead frame main body;
- and
- a sealing resin sealing the LED element and the electric conductor;
- wherein
- a vapor-deposited aluminum layer or a sputtered aluminum layer is provided on an upper surface of the LED element resting region of the lead frame main body, and is further provided on an inner wall of the reflecting resin section and at least a part of an upper surface of the reflecting resin section;
- and
- the vapor-deposited aluminum layer or the sputtered aluminum layer is continuously formed from the upper surface of the LED element resting region to an upper end of the inner wall of the reflecting resin section via a lower end of the inner wall of the reflecting resin section.
11 more elements
Dependencies are inferred from the claim text.