Wavelength conversion element, light-emitting semiconductor component including a wavelength conversion element, method for producing a wavelength conversion element and method for producing a light-emitting semiconductor component including a wavelength conversion element

A method for producing a wavelength conversion element, the method comprising:

• providing a support sheet with a top side and a bottom side lying opposite the top side,
• providing a wavelength converting material on the top side of the support sheet,
• patterning the wavelength converting material directly or indirectly, thereby forming channels in the wavelength converting material which are at least partially surrounded by the wavelength converting material,
• filling the channels with a slurry of non-converting separator material, wherein the non-converting material is non-transmissive to ultraviolet and/or visible light, and
• sintering the wavelength conversion element.

A light-emitting semiconductor component comprising a pixelated light-emitting semiconductor chip, which emits primary radiation during operation via a light coupling-out surface along an emission direction, and a wavelength conversion element,

• the wavelength conversion element comprising at least one sintered wavelength converting material, wherein
• a grid is formed by channels within the sintered wavelength converting material,
• the channels are at least partially surrounded by the sintered wavelength converting material,
• the channels reach at least partially through the sintered wavelength converting material in a direction perpendicular or oblique to a main extension direction of the wavelength conversion element,
• the channels contain a non-converting sintered separator material, and
• the non-converting sintered separator material is non-transmissive to ultraviolet and/or visible light,
• wherein the non-converting sintered separator material absorbs the ultraviolet and/or visible light,
• wherein the wavelength conversion element is arranged on the light coupling-out surface of the light-emitting semiconductor chip.