Deep ultraviolet LED and method for manufacturing the same

A method for manufacturing a deep ultraviolet LED, comprising:

• preparing a substrate and a stacked structure with a design wavelength of λ, the stacked structure including a reflecting electrode layer, a metal layer, a p-type GaN contact layer, and a p-type AlGaN layer that are sequentially stacked from a side opposite to the substrate towards the substrate, the p-type AlGaN layer being transparent to light with the wavelength of λ;
• preparing a mold;
• forming a resist layer on the stacked structure and imprinting a structure of the mold to the resist layer;
• and
• forming a reflective-type photonic crystal periodic structure by sequentially etching the stacked structure with the resist layer as a mask to form the reflective-type photonic crystal periodic structure within the p-type AlGaN layer, and also in a range including at least an interface between the p-type GaN contact layer and the p-type AlGaN layer along a thickness direction to the substrate,
• wherein the reflective-type photonic crystal periodic structure is formed to have a photonic band gap open to TE polarized components, and to satisfy Bragg scattering conditions (m×λ/nav=2a), with m being in a range of 1<m<5, the wavelength λ, a period a, and an average refractive index nav of the p-type AlGaN layer and air in the holes, wherein R/a includes a value with a maximum photonic band gap, and a depth h of the holes is greater than or equal to the period a.