Passive chip device and method of making the same
AssigneeWafer Mems Co., Ltd.
InventorsMin-Ho Hsiao, Pang-Yen Lee, Yen-Hao Tseng
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Abstract
A passive chip device includes a chip body, a conductive coil and a surface-mount contact unit. The chip body is in the form of a single piece, and has two opposite end faces and a first surface which is between the end faces. The conductive coil is deposited on and surrounding the chip body. The surface-mount contact unit includes two spaced apart conductive terminal contacts. Each of the terminal contacts extends from a respective one of the end faces to the first surface and connects to a respective one of end portions of the coil. The method of making the passive chip device is also disclosed.
Claims10
A method of making a surface-mountable passive chip device, comprising:
- forming a patterned wafer which has a peripheral end portion and at least one passive-component unit that includes a connecting portion, a breaking line, and a plurality of spaced apart chip bodies, the connecting portion being connected to the peripheral end portion, the breaking line having a plurality of connecting tabs that are spaced apart from one another, each of the connecting tabs being disposed between and interconnecting the connecting portion and a respective one of the chip bodies, each of the chip bodies extending in an axial direction and having two opposite end faces and a first surface, the end faces being opposite to each other in the axial direction, the first surface extending along the axial direction between the end faces;
- forming a functional layered structure on each of the chip bodies;
- forming a conductive seed layer on the functional layered structure on each of the chip bodies;
- forming a con tact-defining patterned photoresist layer on the conductive seed layer on each of the chip bodies, such that two opposite end portions of the conductive seed layer, which are respectively disposed adjacent to the end faces of the each chip body, are exposed from the contact-defining patterned photoresist layer;
- forming a surface-mount contact unit having two spaced apart conductive terminal contacts that are respectively formed on the end portions of the conductive seed layer on each of the chip bodies, each of the conductive terminal contacts being electro-connected to the functional layered structure and extending from a respective one of the end faces to the first surface;
- removing the contact-defining patterned photoresist layer and the remaining portion of the seed layer that is covered by the contact-defining patterned photoresist layer;
- and
- breaking the patterned wafer along the breaking line by applying an external force thereto so as to form a plurality of passive chip devices.
Dependencies are inferred from the claim text.