Interposers for integrated circuits with multiple-time programming and methods for manufacturing the same
AssigneeGlobalfoundries Singapore Pte. Ltd.
InventorsJuan Boon Tan, Yi Jiang, Danny Shum, Shunqiang Gong
Life of this patent
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Abstract
An interposer for an integrated circuit includes a first side and a second side. The interposer includes a substrate and a via disposed in the substrate. A first electrical contact is disposed on the first side. A second electrical contact is disposed on the second side and electrically connected to the via. The interposer also includes a multiple-time programmable (“MTP”) element electrically connected to the first electrical contact and/or the via.
Claims20
An integrated circuit, comprising:
- a plurality of transistors;
- and
- an interposer having a first side and a second side disposed opposite said first side, said interposer comprising:
- a substrate,
- a plurality of vias disposed in said substrate,
- a plurality of first electrical contacts disposed on said first side of said interposer, wherein at least one of said first electrical contacts is electrically connected to at least one of said transistors, and wherein said plurality of transistors are disposed adjacent said plurality of first electrical contacts,
- a dielectric layer disposed between said plurality of transistors and said substrate,
- a plurality of second electrical contacts comprising solder balls disposed on said second side and wherein each of said second electrical contacts are electrically connected to at least one of said plurality of vias, and
- at least one multiple-time programmable (“MTP”) element disposed in said dielectric layer between said plurality of transistors and said substrate, and electrically connected to said first electrical contacts and/or said plurality of vias.
A method of manufacturing an interposer having a first side and a second side disposed opposite the first side, said method comprising:
- forming a first electrical contact on the first side of the interposer;
- disposing a transistor adjacent the first electrical contact;
- forming a via in a substrate;
- forming a dielectric layer between the transistor and the substrate;
- forming a second electrical contact comprising solder balls on the second side of the interposer and electrically connected to the via;
- and
- forming a multiple-time programmable (“MTP”) element in the dielectric layer between the transistor and the substrate, and electrically connected to the via and/or the first contact.
An interposer for an integrated circuit, said integrated circuit comprising a plurality of transistors, said interposer defining a first side and a second side, comprising:
- a substrate;
- a plurality of vias disposed in said substrate;
- a plurality of first electrical contacts disposed on said first side of said interposer, wherein at least one of said first electrical contacts is electrically connected to at least one of said transistors, and wherein said plurality of transistors are disposed adjacent said plurality of first electrical contacts;
- a dielectric layer disposed between said plurality of transistors and said substrate:
- a plurality of second electrical contacts comprising solder balls disposed on said second side of said interposer, wherein each of said second electrical contacts are electrically connected to at least one of said plurality of vias;
- and
- at least one multiple-time programmable (“MTP”) element disposed in said dielectric layer between said plurality of transistors and said substrate, and electrically connected to at least one of said first electrical contacts and at least one of said vias;
- said at least one MTP element comprising germanium-antimony-tellurium (“GST”).
Dependencies are inferred from the claim text.