Micro wall light emitting diodes
AssigneeIntel Corporation
InventorsKhaled Ahmed, Ali Khakifirooz
Life of this patent
Estimating the term…
Abstract
Embodiments related to light emitting diodes having an electron transport layer core with first and second opposite sidewalls extending from a proximal end of the electron transport layer core adjacent to the substrate to a distal end of the electron transport layer core extending away from the substrate, an emission layer disposed on both the first and second sidewalls, and a hole transport layer disposed on the emission layer, displays having such light emitting diodes, systems incorporating such light emitting diodes, and methods for fabricating them are discussed.
Claims25
A light emitting diode device comprising:
- an electron transport layer core disposed over a substrate, wherein the electron transport layer core comprises a first sidewall and a second sidewall opposite the first sidewall, and wherein the first sidewall and the second sidewall each extend from a proximal end of the electron transport layer core adjacent to the substrate to a distal end of the electron transport layer core extending away from the substrate;
- an emission layer disposed on both the first and second sidewalls;
- and
- a hole transport layer disposed on the emission layer.
A mobile computing platform comprising:
- a microprocessor;
- a display device coupled to the microprocessor, the display device comprising:
- an electron transport layer core disposed over a substrate, wherein the electron transport layer core comprises a first sidewall and a second sidewall opposite the first sidewall, and wherein the first sidewall and the second sidewall each extend from a proximal end of the electron transport layer core adjacent to the substrate to a distal end of the electron transport layer core extending away from the substrate;
- an emission layer disposed on both the first and second sidewalls;
- and
- a hole transport layer disposed on the emission layer;
- and
- a wireless transceiver communicatively coupled to the microprocessor.
A method for fabricating a light emitting diode device comprising
- disposing an electron transport layer core within a trench of a patterned layer over a substrate, wherein the electron transport layer core comprises a first sidewall and a second sidewall opposite the first sidewall, and wherein the first sidewall and the second sidewall each extend from a proximal end of the electron transport layer core adjacent to the substrate to a distal end of the electron transport layer core extending away from the substrate;
- removing at least a portion of the patterned layer to expose at least a portion of the first sidewall and at least a portion of the second sidewall;
- disposing an emission layer on both the portion of the first sidewall and the portion of the second sidewall;
- and
- disposing a hole transport layer on the emission layer.
Dependencies are inferred from the claim text.