Solid state image pickup apparatus and method for manufacturing the same
AssigneeCanon Kabushiki Kaisha
InventorKyouhei Watanabe
Life of this patent
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Abstract
When forming a hollow portion between each color filter, in order to realize the formation of the hollow portions with a narrower width, a plurality of light receiving portions are formed on the upper surface of a semiconductor substrate, a plurality of color filters corresponding to each of the light receiving portions are formed above the semiconductor substrate, a photoresist is formed on each color filter, side walls are formed on the side surfaces of the photoresist, and a hollow portion is formed between each color filter by performing etching using at least the side walls as a mask.
Claims6
A method for manufacturing a solid state image pickup apparatus in which a plurality of light receiving portions are provided on an upper surface of a semiconductor substrate, comprising:
- forming a plurality of color filters corresponding to each light receiving portion in such a manner as to contact each other above the semiconductor substrate;
- forming a hard mask on the plurality of color filters;
- forming a resist pattern having first openings on the hard mask;
- heat treating the resist pattern to form an etching mask having second openings whose width is smaller than that of the first openings;
- performing first etching using the etching mask as a mask to form openings in the hard mask;
- performing second etching using at least the hard mask as a mask to form an opening between each color filter;
- and
- forming a cap layer covering the opening formed between each color filter to form an air gap between each color filter.
Dependencies are inferred from the claim text.