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US 9,806,120 B2Granted
Solid-state image pickup apparatus and electronic apparatus
AssigneeSony Corporation
InventorsTakuya Sano, Toshifumi Wakano
Life of this patent
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Abstract
A solid-state image pickup apparatus includes a pixel region in which a plurality of pixels each including a photoelectric conversion element are arranged, transfer wirings formed on the pixel region in parallel to each other with uniform opening widths, and different wirings formed in a wiring layer above the transfer wirings. At least a part of the different wirings is overlapped with the transfer wirings on a plan position. The transfer wirings and the different wirings form a light shielding structure in the pixel region.
Claims28
An imaging device, comprising:
- a first semiconductor chip unit including
- a plurality of photoelectric conversion elements,
- a first wiring layer having a first wiring, and
- a second wiring layer having a second wiring coupled to a transfer gate associated with a respective photoelectric conversion element, and further having a third wiring that is a dummy wiring;
- and
- a second semiconductor chip unit including a logic circuit, wherein
- the first semiconductor chip unit is bonded to the second semiconductor chip unit,
- the second wiring is adjacent the third wiring with a gap therebetween, such that the gap overlaps a portion of the respective photoelectric conversion element, in a plan view, and
- the first wiring includes a first portion that overlaps a portion of the second wiring and a second portion that overlaps the gap, in the plan view.
6 more elements
An electronic apparatus, comprising:
- an imaging device comprising
- a first semiconductor chip unit including
- a plurality of photoelectric conversion elements,
- a first wiring layer having a first wiring, and
- a second wiring layer having a second wiring coupled to a transfer gate associated with a respective photoelectric conversion element, and further having a third wiring that is a dummy wiring, and
- a second semiconductor chip unit including a logic circuit;
- and
- a signal processing circuit configured to process a pixel signal generated by the imaging device, wherein
- the first semiconductor chip unit is bonded to the second semiconductor chip unit,
- the second wiring is adjacent the third wiring with a gap therebetween, such that the gap overlaps a portion of the respective photoelectric conversion element, and
- the first wiring includes a first portion that overlaps a portion of the second wiring and a second portion that overlaps the gap, in the plan view.
8 more elements
Dependencies are inferred from the claim text.