Back to results
US 9,806,069 B2Granted
Semiconductor device and method of manufacturing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui Hsieh Lai, Ying-Hao Kuo, Kuo-Chung Yee
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a first chip, a dielectric layer over the first chip, and a second chip over the dielectric layer. A conductive layer is embedded in the dielectric layer and is electrically coupled to the first chip and the second chip. The second chip includes an optical component. The first chip and the second chip are arranged on opposite sides of the dielectric layer in a thickness direction of the dielectric layer.
Claims20
A method comprising:
- encapsulating a first chip in a first encapsulating material;
- forming a re-distribution layer over the first encapsulating material and the first chip, the re-distribution layer being electrically coupled to the first chip;
- forming a waveguide over the first encapsulating material;
- and
- bonding a second chip to the re-distribution layer, wherein the re-distribution layer is electrically coupled to the second chip, and the second chip comprises an optical component in optical alignment with the waveguide.
2 more elements
A method comprising:
- placing a first chip and a second chip over a carrier;
- encapsulating the first chip and the second chip in a first encapsulating material;
- releasing the carrier to expose the first chip and the second chip;
- forming a first dielectric layer over and contacting the first chip, the second chip, and the first encapsulating material;
- forming a first opening and a second opening to expose a first contact pad of the first chip and a second contact pad of the second chip, respectively;
- forming a conductive layer with first portions over the first dielectric layer, wherein the conductive layer comprises second portions extending into the first dielectric layer to electrically couple to the first contact pad and the second contact pad;
- forming a second dielectric layer over the conductive layer;
- forming a waveguide over the first encapsulating material;
- and
- bonding a second chip to the conductive layer, wherein the conductive layer is electrically coupled to the second chip, and the second chip comprises an optical component in optical alignment with the waveguide.
7 more elements
A method comprising:
- forming a re-distribution layer comprising;
- a first dielectric layer;
- a second dielectric layer;
- and
- a conductive layer having a portion between the first dielectric layer and the second dielectric layer;
- forming a waveguide on a side of the re-distribution layer;
- bonding an optical chip to the re-distribution layer, wherein the optical chip comprises an optical component;
- and
- encapsulating the waveguide and the optical chip with a transparent encapsulating material, wherein the waveguide and the optical component in the optical chip are optically coupled to each other through a portion of the transparent encapsulating material.
6 more elements
Dependencies are inferred from the claim text.