Die-die stacking
AssigneeGlobalfoundries Inc.
InventorsSven Beyer, Jan Hoentschel, Alexander Ebermann
Life of this patent
Estimating the term…
Abstract
A semiconductor die is provided with an optical transmitter configured to transmit an optical signal to another die and an optical receiver configured to receive an optical signal from another die. Furthermore, a method of forming a semiconductor device is provided including forming a first semiconductor die with the steps of providing a semiconductor substrate, forming a transistor device at least partially over the semiconductor substrate, forming an optical receiver one of at least partially over and at least partially in the semiconductor substrate, forming a metallization layer over the transistor device, and forming an optical transmitter one of at least partially over the metallization layer and at least partially in the metallization layer.
Claims8
An integrated circuit product, comprising:
- a stack of semiconductor die comprising a first semiconductor die, a second semiconductor die and a third semiconductor die, wherein said first semiconductor die is stacked above said second semiconductor die and said third semiconductor die is stacked above said first semiconductor die;
- a first optical transmitter and a first optical receiver positioned in said first semiconductor die, wherein said first optical transmitter is configured to transmit a first optical signal to said third semiconductor die and said first optical receiver is configured to receive a second optical signal from said second semiconductor die;
- a second optical transmitter positioned in said second semiconductor die, wherein said second optical transmitter is configured to transmit said second optical signal to said first semiconductor die;
- and
- a second optical receiver positioned in said third semiconductor die, wherein said second optical receiver is configured to receive said first optical signal.
Dependencies are inferred from the claim text.