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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsShin-Puu Jeng, Wen-Chih Chiou, Tu-Hao Yu, Hung-Jung Tu, Yu-Liang Lin, Shih-Hui Wang
Estimating the term…
Packaged semiconductor devices are disclosed. In some embodiments, a packaged semiconductor device includes a substrate and a plurality of integrated circuit dies coupled to the substrate. The device also includes a molding material disposed over the substrate between adjacent ones of the plurality of integrated circuit dies. A cap layer is disposed over the molding material and the plurality of integrated circuit dies, wherein the cap layer comprises an electrically conductive material that directly contacts the molding material and each of the plurality of integrated circuit dies.
A packaged semiconductor device, comprising:
A device, comprising:
A device, comprising:
Dependencies are inferred from the claim text.