Bumpless wafer level fan-out package
AssigneeAltera Corporation
InventorMinghao Shen
Life of this patent
Estimating the term…
Abstract
An integrated circuit package may include a first conductive pad on an interposer substrate, and a second conductive pad formed on a front surface of an integrated circuit die. The second conductive pad may directly contact the first conductive pad on the interposer substrate. The integrated circuit package may further include a package substrate having a cavity, in which the interposer substrate and the integrated circuit are disposed in the cavity. The interposer substrate may include interconnect pathways that are electrically coupled to the first and second conductive pads. A heat spreader may subsequently form over the integrated circuit die and the package substrate.
Claims20
An integrated circuit package comprising:
- an interposer substrate;
- a first conductive pad on the interposer substrate;
- a second conductive pad formed on a front surface of an integrated circuit die, wherein the second conductive pad directly contacts the first conductive pad on the interposer substrate;
- and
- a continuous package substrate having a cavity defined by a continuous wall comprising substantially the same material, wherein the interposer substrate and the integrated circuit die are disposed in the cavity.
An integrated circuit package, comprising:
- an interposer substrate having a surface, the interposer substrate having a plurality of conductive pads on the surface;
- an integrated circuit die having front and back surfaces, wherein the integrated circuit die is mounted on the interposer substrate, and wherein the front surface of the integrated circuit die faces the interposer substrate;
- a plurality of contact pads formed on the front surface of the integrated circuit die, each of which makes direct physical contact with a corresponding conductive pad in the plurality of conductive pads;
- and
- a continuous package substrate having a continuous wall comprising substantially the same material that surrounds the interposer substrate and the integrated circuit die.
A method of fabricating an integrated circuit package, comprising:
- forming a first plurality of conductive pads on an interposer substrate;
- forming a second plurality of conductive pads on an integrated circuit die;
- assembling the integrated circuit die on the interposer substrate so that each conductive pad in the second plurality of conductive pads makes direct physical contact with a corresponding conductive pad in the first plurality of conductive pads;
- and
- embedding the integrated circuit die and the interposer substrate in a continuous package substrate to form the integrated circuit package, wherein the integrated circuit die and the interposer are surrounded by a continuous wall of the continuous package substrate, comprising substantially the same material.
Dependencies are inferred from the claim text.