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US 9,806,060 B2Granted
Flexible packages including chips
AssigneeSK hynix Inc.
InventorChan Woo Jeong
Life of this patent
Estimating the term…
Abstract
A flexible package may be provided. The flexible package may include a flexible molding member including a top surface. The flexible package may include a first chip within the flexible molding member, and including a first top surface. The flexible package may include a second chip within the flexible molding member, and including a second top surface. The first top surface may face away from the top surface of the flexible molding member and the second top surface may face towards the top surface of the flexible molding member.
Claims19
A flexible package comprising:
- a flexible molding member including a top surface;
- a first chip within the flexible molding member, and including a first top surface;
- a second chip within the flexible molding member, and including a second top surface;
- a third chip within the flexible molding member, and including a third top surface,
- wherein the first, second, and third top surfaces are substantially concave,
- wherein the first top surface faces towards the top surface of the flexible molding member,
- wherein the second and third top surfaces face away from the top surface of the flexible molding member, and
- wherein at least one of the first, second, and third chips are configured to be straightened in response to an external force applied to the flexible molding member.
5 more elements
Dependencies are inferred from the claim text.