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US 9,806,058 B2Granted
Chip package having die structures of different heights and method of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWen-Hsin Wei, Chi-Hsi Wu, Chen-Hua Yu, Hsien-Pin Hu, Shang-Yun Hou, Wei-Ming Chen
Life of this patent
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Abstract
Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
Claims20
A chip package, comprising:
- a chip stack including a plurality of semiconductor dies;
- a semiconductor chip, wherein the semiconductor chip is higher than the chip stack;
- and
- a package layer overfilling a gap between the chip stack and the semiconductor chip, the package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
1 more element
A chip package, comprising:
- a first semiconductor chip;
- a second semiconductor chip;
- and
- a molding compound layer surrounding the first semiconductor chip and the second semiconductor chip, wherein the molding compound layer covers a top surface of the first semiconductor chip, and a top surface of the molding compound layer is substantially coplanar with a top surface of the second semiconductor chip.
1 more element
A method for forming a chip package, comprising:
- bonding a first semiconductor chip and a second semiconductor chip over a substrate;
- forming a package layer over the substrate to encapsulate the first semiconductor chip and the second semiconductor chip;
- and
- planarizing the package layer so that a top surface of the second semiconductor chip is exposed, and a top surface of the first semiconductor chip is covered by the package layer.
1 more element
Dependencies are inferred from the claim text.