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US 9,806,053 B2Granted
Semiconductor package
AssigneeMediatek Inc.
InventorNan-Jang Chen
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a first substrate, a first conductive layer, a first surface mount device (SMD) and a first bonding wire. The first substrate has a first top surface. The first conductive layer is formed on the first top surface and has a first conductive element and a second conductive element separated from each other. The first SMD is mounted on the first top surface, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.
Claims20
A semiconductor package, comprising:
- a first substrate having a first top surface;
- a first conductive layer formed on the first top surface and having a first conductive element and a second conductive element separated from each other;
- a first surface mount device (SMD) mounted on the first top surface, overlapping with and electrically isolated from the first conductive element;
- and
- a first bonding wire electrically connect the first SMD with the first conductive layer.
2 more elements
A semiconductor package, comprising:
- a first substrate having a first top surface;
- a first conductive layer formed on the first top surface and having a first conductive element and a second conductive element separated from each other;
- a first surface mount device (SMD) mounted on the first top surface, overlapping with and electrically isolated from the first conductive element;
- a first bonding wire electrically connect the first SMD with the first conductive layer;
- and
- a second SMD having a second top surface disposed between the first substrate and the first SMD, through which the first SMD is mounted on the second top surface and electrically isolated from the first conductive element.
3 more elements
Dependencies are inferred from the claim text.