Semiconductor package interconnect
AssigneeQUALCOMM Incorporated
InventorsLizabeth Ann Keser, Reynante Tamunan Alvarado
Life of this patent
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Abstract
A semiconductor package interconnect system may include a conductive pillar having a core, a first layer surrounding the core, and a second layer surrounding the first layer. The core may be composed of a drawn copper wire, the first layer may be composed of nickel, and the second layer may be composed of a solder. A method for manufacturing a semiconductor package with such a conductive pillar may include placing a plurality of conductive pillars on a substrate using a stencil process.
Claims24
A package interconnect apparatus, comprising:
- a conductive pillar with a core and a first layer that at least partially surrounds the core, wherein the core is composed of a drawn copper wire, and the first layer is composed of a solder material and has a reflowed first end wider than a second end opposite the first end;
- a redistribution layer coupled to the conductive pillar;
- and
- a die coupled to the redistribution layer proximate to the conductive pillar.
A package, comprising:
- a dielectric material;
- a redistribution layer coupled to the dielectric material;
- a die coupled to the redistribution layer;
- a plurality of conductive pillars coupled to the redistribution layer proximate to the die;
- and
- each of the plurality of conductive pillars comprises a core and a first layer that at least partially surrounds the core, wherein the core is composed of a drawn copper wire and the first layer is composed of a solder material and has a reflowed first end wider than a second end opposite the first end.
A method for forming a package, the method comprising:
- applying an adhesive material to a carrier;
- forming a plurality of conductive pads on the adhesive material;
- forming a plurality of solder joints on the plurality of conductive pads;
- forming a plurality of conductive pillars, each of the plurality of conductive pillars comprises a core of a drawn copper wire and a first layer of solder material that at least partially surrounds the core;
- aligning, by a stencil, a plurality of conductive pillars on the plurality of solder joints;
- reflowing the plurality of conductive pillars and the plurality of solder joints to couple the plurality of conductive pillars to the plurality of conductive pads and wherein the reflowing forms a reflowed first end on each of the plurality of conductive pillars wider than a second end opposite the first end;
- attaching a die to the adhesive material;
- applying a molding compound, the molding compound encapsulating the die;
- removing the carrier and the adhesive material;
- and
- forming a dielectric layer and a redistribution layer, the redistribution layer coupled to the plurality of conductive pads.
Dependencies are inferred from the claim text.