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US 9,806,045 B2Granted
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang, Chia-Chun Miao, Hao-Yi Tsai
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Abstract
A semiconductor device includes a carrier, an under bump metallurgy (UBM) pad on the carrier, and a post on a surface of the UBM pad. In some embodiments, a height of the post to a longest length of the UBM pad is between about 0.25 and about 0.7. A method of manufacturing a semiconductor device includes providing a carrier, disposing a UBM pad on the carrier and forming a post on the UBM pad.
Claims20
A semiconductor device, comprising:
- a silicon substrate;
- a printed circuit board (PCB);
- a first pad on the silicon substrate;
- a second pad on the PCB;
- a post on a surface of the first pad, wherein the post consists of a metal or a metal alloy;
- a joint disposed between the silicon substrate and the PCB, contacted with the first pad and the second pad, and encapsulating the post;
- a first entire contact interface between the first pad and the joint;
- a second entire contact interface between the first pad and the post;
- and
- a third entire contact interface between the joint and the second pad, wherein an outer surface of the joint is concave and curved towards the post, and a height of the post is greater than or equal to ⅓ of a height of the joint between the first pad and the second pad, the first entire contact interface, the second entire contact interface and the third entire contact interface are flat surfaces, wherein a distance between the first entire contact interface and the third entire contact interface is equal to a distance between the second entire contact interface and the third entire contact interface, the second entire contact interface is a continuous surface.
7 more elements
A semiconductor device, comprising:
- a silicon substrate including a first pad;
- a PCB including a second pad disposed opposite to the first pad;
- a post coupled with and standing on the first pad, wherein the post consists of a metal or a metal alloy;
- a joint encapsulating the post and bonding the first pad with the second pad;
- a first entire contact interface between the first pad and the joint;
- a second entire contact interface between the first pad and the post;
- and
- a third entire contact interface between the joint and the second pad, wherein an outer surface of the joint is concave and curved towards the post, and a height of the post is greater than or equal to ⅓ of a distance between the first pad and the second pad, the first entire contact interface, the second entire contact interface and the third entire contact interface are flat surfaces, wherein a distance between the first entire contact interface and the third entire contact interface is equal to a distance between the second entire contact interface and the third entire contact interface, the second entire contact interface is a continuous surface.
5 more elements
Dependencies are inferred from the claim text.