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US 9,806,042 B2Granted
Strain reduced structure for IC packaging
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Wei Chen, Ying-Ju Chen, Tsung-Yuan Yu, Yu-Feng Chen, Tsung-Ding Wang
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Abstract
A semiconductor device includes a semiconductor die having first and second conductive pads, and a substrate having third and fourth bonding pads. A width ratio of the first conductive pad over the third bonding pad at an inner region is different from a width ratio of the second conductive pad over the fourth bonding pad at an outer region.
Claims23
A device, comprising:
- a semiconductor die, wherein the semiconductor die includes
- a first pad having a first width on a first region of the semiconductor die;
- and
- a second pad having a second width on a second region of the semiconductor die;
- a substrate, wherein the substrate includes
- a third pad having a third width on a third region of the substrate;
- and
- a fourth pad having a fourth width on a fourth region of the substrate;
- and
- a conductive material coupled between the first pad and the third pad, and between the second pad and the fourth pad;
- wherein a ratio A of the first width of the first pad to the third width of the third pad is smaller than a ratio B of the second width of the second pad to the fourth width of the fourth pad.
8 more elements
A device, comprising:
- a semiconductor die,
- a substrate,
- the semiconductor die coupled to the substrate by a plurality of conductive materials, wherein each conductive material among the plurality of conductive materials couples a conductive pad having a first width on the semiconductor die and a bonding pad having a second width on the substrate and is defined by a ratio of the first width to the second width;
- wherein, among the plurality of conductive materials, the ratio for a conductive material further from a center of the device is larger than the ratio for a conductive material closer to the center of the device.
1 more element
A device, comprising:
- a semiconductor die;
- a substrate;
- and
- a plurality of conductive materials coupling the semiconductor die to the substrate,
- wherein
- each conductive material among the plurality of conductive materials couples a conductive pad on the semiconductor die and a bonding pad on the substrate, and is defined by a ratio of a width of the conductive pad to a width of the bonding pad,
- the plurality of conductive materials includes first conductive materials in a first region and second conductive materials in a second region, the second region extending around the first region, and
- the ratios of the first conductive materials are different from the ratios of the second conductive materials.
5 more elements
Dependencies are inferred from the claim text.