Method for processing an electronic component and an electronic component

A method for processing an electronic component comprising at least one electrically conductive surface, the method comprising:

• forming a metallization comprising a self-segregating composition over the at least one electrically conductive surface to electrically contact the electronic component;
• forming a segregation suppression structure between the metallization and the electronic component, wherein the segregation suppression structure comprises more nucleation inducing topography features than the at least one electrically conductive surface for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the metallization defined by the nucleation inducing topography features.

A method for processing an electronic component comprising at least one electrically conductive surface, the method comprising:

• forming a contact pad comprising an aluminum bronze over the at least one electrically conductive surface to electrically contact the electronic component;
• forming a segregation suppression structure between the contact pad and the electronic component, wherein the segregation suppression structure comprises more protrusions than the at least one electrically conductive surface for perturbing a chemical segregation of the self-segregating composition by crystallographic interfaces of the contact pad induced by the protrusions.