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US 9,806,038 B2Granted
Reinforcement structure and method for controlling warpage of chip mounted on substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Shang-Yun Hou, Cheng-Chieh Hsieh, Tsung-Shu Lin
Life of this patent
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Abstract
A semiconductor device comprises a substrate, a die mounted on the substrate, a reinforcement plate bonded to the die, and an adhesive layer coupling the reinforcement plate to the die.
Claims19
A semiconductor device, comprising:
- a substrate;
- a die mounted on the substrate, the die having a rightmost edge and a leftmost edge, the substrate extending unbroken below the die from the rightmost edge to the leftmost edge of the die;
- a reinforcement plate having a periphery and a center region, the reinforcement plate being continuous from a top leftmost corner of the periphery to a bottom rightmost corner of the periphery through the center region;
- and
- an adhesive layer bonding the reinforcement plate to the die, the die being interposed between the substrate and the reinforcement plate.
2 more elements
A package comprising:
- a die having an active surface, the active surface being electrically coupled with a surface of a substrate;
- and
- a reinforcement plate adhered to the die with an adhesive, the reinforcement plate comprising a metal and having a periphery and a center region, the reinforcement plate being continuous from a top rightmost corner of the periphery to a bottom leftmost corner of the periphery through the center region, and the reinforcement plate comprising a notch proximate corners of the reinforcement plate, the notch configured to receive the adhesive.
A semiconductor device, comprising:
- a die having a bottommost surface and a topmost surface opposite the bottommost surface;
- a substrate coupled to the bottommost surface of the die;
- a reinforcement plate, wherein the reinforcement plate:
- has a bottommost surface coupled to the topmost surface of the die, the bottommost surface of the reinforcement plate being above the topmost surface of the die;
- has a border region and a center region;
- has a first thickness in the center region;
- and
- is continuous from a top leftmost corner of the border region to a bottom rightmost corner of the border region through the center region;
- and
- an adhesive layer coupling the reinforcement plate to the topmost surface of the die.
7 more elements
Dependencies are inferred from the claim text.