Semiconductor wafer, semiconductor structure and method of manufacturing the semiconductor wafer

A method of manufacturing a semiconductor wafer, the method comprising:

• preparing a semiconductor wafer, the semiconductor wafer including first and second surfaces opposite each other and a notch on an outer periphery of the semiconductor wafer, the notch including a recess on the outer periphery toward a center portion of the semiconductor wafer;
• forming, by processing the outer periphery of the semiconductor wafer, a first bevel region, the first bevel region including a first slope connecting the first and second surfaces, the first slope having a first height with respect to a straight line extending from a first point to a second point, the first point being a point where the first surface and the first slope meet, and the second point being a point where the second surface and the first slope meet;
• and
• forming, by processing the notch, a second bevel region, the second bevel region contacting the recess, the second bevel region including a second slope connecting the first and second surfaces such that the second bevel region is within the notch and the first bevel region is along a rest of the outer periphery of the semiconductor wafer abutting the second bevel region, the second slope having a second height, different from the first height, with respect to a straight line extending from a third point to a fourth point, the third point being a point where the first surface and the second slope meet, and the fourth point being a point where the second surface and the second slope meet.