Prototyping of electronic circuits with edge interconnects

A method of forming an assembly including projecting or protruding nodules, the method comprising:

• (a) forming a first, microchip receiving cavity in a surface of a substrate formed of a substrate material;
• (b) forming a plurality of second, nodule cavities in the surface of the substrate proximate to the first receiving cavity;
• (c) following step (a), inserting a microchip in the first cavity, with a top surface of the microchip facing outward from the first cavity having an electrical circuit formed thereon;
• (d) following step (b), depositing electrically conductive material in each second cavity thereby forming a conductive pad in said second cavity, with a top surface of each conductive pad facing outward from the second cavity;
• (e) following steps (a)-(d), forming conductive traces on the top surface of the microchip, wherein each conductive trace connects at least one conductive pad to at least one element of the electrical circuit;
• and
• (f) removing portions of the substrate material to form from the substrate material a carrier that supports the conductive pads proximate to the microchip with a portion of each conductive pad projecting or protruding from the carrier.