Transistor arrangement with semiconductor chips between two substrates
AssigneeInfineon Technologies Austria AG
InventorsRalf Otremba, Josef Hoeglauer, Chooi Mei Chong
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Abstract
An electronic device comprising a first substrate, a second substrate, a first semiconductor chip comprising a transistor, comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, and a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate, wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface.
Claims20
An electronic device, comprising:
- a first substrate;
- a second substrate;
- a first semiconductor chip comprising a transistor, a first mounting surface bonded to the first substrate and a second mounting surface bonded to the second substrate;
- a second semiconductor chip comprising a first mounting surface bonded to the first substrate and comprising a second mounting surface bonded to the second substrate;
- wherein the first semiconductor chip comprises a via electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface.
An electronic power device, comprising:
- a first substrate
- a second substrate;
- a first semiconductor power chip comprising a first transistor, a first mounting surface with two transistor terminals bonded to the first substrate and a second mounting surface with one transistor terminal bonded to the second substrate;
- a second semiconductor power chip comprising a second transistor, a first mounting surface with two transistor terminals bonded to the first substrate and a second mounting surface with one transistor terminal bonded to the second substrate;
- wherein, in a plan view perpendicular to the mounting surfaces, the second substrate covers the entire second mounting surface of the first semiconductor power chip and the entire second mounting surface of the second semiconductor power chip.
A method of manufacturing an electronic device, wherein the method comprises:
- bonding a first mounting surface of a first semiconductor chip to a first substrate;
- bonding a first mounting surface of a second semiconductor chip to the first substrate;
- bonding a second mounting surface of the first semiconductor chip to a second substrate;
- bonding a second mounting surface of the second semiconductor chip to the second substrate;
- forming a via extending through the first semiconductor chip for electrically coupling a first transistor terminal at its first mounting surface with a second transistor terminal at its second mounting surface.
Dependencies are inferred from the claim text.